{"product_id":"sita-bga-amaoe-universala-02-03-035-04-05","title":"BGA Amaoe Screen, Universal (0.2 \/ 0.3 \/ 0.35 \/ 0.4 \/ 0.5)","description":"\u003cdiv class=\"text-editor-custom-title\"\u003eAmaoe Universal BGA Stencil (0.2 \/ 0.3 \/ 0.35 \/ 0.4 \/ 0.5)\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003eThe set of two Amaoe universal BGA stencils represents a professional and highly versatile solution for reballing operations \u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003eand restoration of solder contacts (tin planting) on IC chips and processors of mobile devices. This premium kit is configured\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e with a wide range of hole configurations, including parallel slots, holes inclined at 45 degrees, and offset grids, \u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003ebeing capable of covering almost any current chip architecture on the smartphone market. The set is designed to offer technicians\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e multiple pin spacing options, from ultra-fine profiles of 0.2 mm and 0.3 mm, up to standards of 0.35 mm, 0.4 mm, and 0.5 mm. \u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003eMade from high-quality steel resistant to thermal deformation, these sheets ensure perfectly uniform solder paste distribution \u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003eand micrometric alignment, optimizing the success rate in GSM repair shops.\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cimg src=\"https:\/\/img.gsmnet.ro\/800X800\/products\/242729\/sita-bga-amaoe-universala-1-1780903875.png\" title=\"sita-bga-amaoe-2C-universala--280.2---0.3---0.35---0.4---0.5-29-\" alt=\"sita-bga-amaoe-2C-universala--280.2---0.3---0.35---0.4---0.5-29-\" class=\"text-editor-custom-img text-editor-custom-img-for-split\" style=\"width: 50%;\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cb\u003eFeatures:\u003c\/b\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Pin spacing options: 0.2 mm, 0.3 mm, 0.35 mm, 0.4 mm, and 0.5 mm\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Mesh hole configurations: Parallel holes, holes inclined at 45 degrees, and offset arrangement\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Material properties: High heat resistance, flexible steel resistant to deformation under hot air\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Main function: Formation and calibration of solder balls on integrated circuits (Tin Planting Template)\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Compatibility: Universal, suitable for most IC chips and CPUs used in phones and tablets\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e- Application: Precision micro-electronics, motherboard refurbishment, and professional GSM service\u003c\/div\u003e\u003cdiv class=\"text-editor-custom-paragraph\"\u003e\u003cbr\u003e\u003c\/div\u003e\u003c\/div\u003e","brand":"Amaoe","offers":[{"title":"Default Title","offer_id":58677149598028,"sku":"380831","price":12.05,"currency_code":"CHF","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0833\/9102\/1388\/files\/sita-bga-amaoe-universala-1-1780903875.png?v=1788452168","url":"https:\/\/gsmnetshop.ch\/en\/products\/bga-amaoe-screen-universal-02-03-035-04-05","provider":"GSMnet","version":"1.0","type":"link"}