Presentation
| Product range | XGSP50 |
| Product type | Fludor Paste |
Sale package
| Pack | Bulk |
| Content | Fludor Paste |
| Product status | New |
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Mechanic XGSP50 Solder Paste, Melting Point 183 Degrees
Mechanic XGSP50 Solder Paste, Melting Point 183 Degrees
ID: 371243
Regular price
CHF 5.23
Regular price
Sale price
CHF 5.23
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6 months
Out of stock
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Mechanic XGSP50 Solder Paste
Mechanic XGSP50 solder paste is a high-quality professional solution, designed for specialists in microelectronics, GSM repairs
and technical workshops working with SMD components. With a melting point of 183 degrees C, this low-temperature paste is
ideal for interventions on sensitive circuits or rework operations that require precise thermal control. Its balanced formula
ensures excellent wetting, optimal conductivity, and high thermal stability. It offers perfect adherence to pads and
components, ensuring clean, durable solder joints with minimal residues. The packaging in a 42 g container makes it suitable
for use in small workshops or in small batch production.
Features:
- Melting point: 183 degrees C
- Composition: Sn63/Pb37 alloy
- Viscosity: suitable for manual or automatic soldering
- Use: rework, SMD soldering, BGA, QFN, LED, etc.
- Application: compatible with syringe, spatula, or stencil
- Conductivity: high
- Residues: low level after soldering
- Storage: in a cool place (0 degrees - 10 degrees C recommended)